Title :
High performance sub-40 nm CMOS devices on SOI for the 70 nm technology node
Author :
Narasimha, S. ; Ajmera, A. ; Park, H. ; Schepis, D. ; Zamdmer, N. ; Jenkins, K.A. ; Plouchart, J.-O. ; Lee, W.-H. ; Mezzapelle, J. ; Bruley, J. ; Doris, B. ; Sleight, J.W. ; Fung, S.K. ; Ku, S.H. ; Mocuta, A.C. ; Yang, I. ; Gilbert, P.V. ; Muller, K.P. ;
Author_Institution :
IBM Microelectron. Semicond. Res. & Dev. Center, Hopewell Junction, NY, USA
Abstract :
This work reports on a methodology for achieving high drive current and low gate delay that can be used for the 70 nm technology node. A combination of optimized device design and aggressive gate oxide scaling has been applied to fabricate transistors with saturation currents of 1080 uA/um (NFET, 1171 uA/um dynamic) and 490 uA/um (PFET, 507 uA/um dynamic) at I/sub off/ levels of 100 nA/um for 1.1 volt operation. The physical gate length (L/sub poly/) for these devices is 39 nm. The saturation currents increase to 1180 uA/um and 540 uA/um at I/sub off/ levels of 300 nA/um, which corresponds to gate delays of 0.61 ps and 1.25 ps for NFET and PFET, respectively. These are among the lowest CV/I values ever reported for conventional CMOS scaling. These devices also exhibit excellent high-frequency response, which makes this technology ideally suited for system-on-chip applications that require both high-frequency signal processing and high-speed digital logic. A record high NFET f/sub max/ of 193 GHz has been demonstrated along with an f/sub T/ of 178 GHz.
Keywords :
MOSFET; silicon-on-insulator; 1.1 V; 39 nm; 70 nm; CMOS transistor; CV/I gate delay; NFET; PFET; SOI technology; design optimization; drive current; gate oxide scaling; high-frequency signal processing; high-speed digital logic; saturation current; system-on-chip; Annealing; CMOS technology; Degradation; Delay; Design optimization; Digital signal processing; Implants; Microelectronics; Research and development; System-on-a-chip;
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
DOI :
10.1109/IEDM.2001.979586