DocumentCode
2168047
Title
Localized heating effects and scaling of sub-0.18 micron CMOS devices
Author
Pop, E. ; Banerjee, K. ; Sverdrup, P. ; Dutton, R. ; Goodson, K.
Author_Institution
Dept. of Electr. Eng., Stanford Univ., CA, USA
fYear
2001
fDate
2-5 Dec. 2001
Abstract
Explores the generation and effect of phonon hot spots in silicon CMOS devices under steady state operation. The phonon Boltzmann transport equation (BTE) is used to extract generated phonon distributions for devices with channel length (L/sub eff/) down to 90 nm. Estimates are made of the impact of phonon hot spots on transistor operation into the L/sub eff/ range approaching 10 nm. In this scaling limit the dimensions of the phonon hot spot are comparable to the device channel length. It is shown that localized drain region hot spots alter drain characteristics and, in the extreme scaling limit, may affect the resistance and electron injection at the source end, hence the current drive of a device. This is the first study that attempts to quantify nonequilibrium hot phonon effects in ultra-scaled CMOS devices and their implications for future scaling.
Keywords
Boltzmann equation; MOSFET; hot carriers; inversion layers; leakage currents; 90 to 180 nm; Boltzmann transport equation; CMOS devices; Si; device channel length; drain characteristics; electron injection; generated phonon distributions; localized heating effects; phonon hot spots; scaling; steady state operation; Acoustic scattering; Electron optics; Energy exchange; Heating; Isothermal processes; Lattices; Optical scattering; Phonons; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-7050-3
Type
conf
DOI
10.1109/IEDM.2001.979598
Filename
979598
Link To Document