DocumentCode :
2168353
Title :
A futur view of SoC in the post 45nm era
Author :
Ko, Uming
Author_Institution :
TI, USA
fYear :
2008
fDate :
2-4 June 2008
Abstract :
While the semiconductor industry has delivered tremendous advancements over the years, the 45nm process node era is still in its infancy with only ≪20% of the market actually utilizing this process node by 2010. There are still many, many more benefits to be realized from 45nm technology. Over the last two decades of semiconductor process technology advancements, the electronics industry has enjoyed continuous improvements in performance, reduction in power and reduction in die size. And, these trends are expected to continue into the future as the industry moves into 45nm and beyond. Dr. Uming Ko, Senior Fellow and Director of Wireless Chip Technology Center from Texas Instrument’s will talk about the future trends expected in the post 45nm era of process technology, continued improvements in performance, power and size. He will also assess the characteristics of different end products such as wireless handsets, advanced imaging and surveillance and medical electronics, to determine which semiconductor products and markets might be good candidates for driving advanced process nodes. Advanced process nodes beyond 45nm will continue to deliver the types of advancements we’ve experienced historically; however going forward there is an increasing need to assess which products make sense for advanced nodes regardless of what is technically feasible. Dr. Ko will evaluate SoC trends going forward and will discuss the broader, market-based considerations for technology decisions in the post 45nm era.
Keywords :
Circuits; Electronics industry; Energy consumption; Error analysis; Microelectronics; Pattern matching; Process design; Research and development; Research and development management; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location :
Grenoble, France
Print_ISBN :
978-1-4244-1810-7
Electronic_ISBN :
978-1-4244-1811-4
Type :
conf
DOI :
10.1109/ICICDT.2008.4567226
Filename :
4567226
Link To Document :
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