Title :
3D-structured on-chip buck converter for distributed power supply system in SiPs
Author :
Takamiya, Makoto ; Onizuka, Kohei ; Sakurai, Takayasu
Author_Institution :
VLSI Design & Educ. Center, Univ. of Tokyo, Tokyo
Abstract :
An on-chip buck converter with 3D chip stacking is proposed and the operation is experimentally verified. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70mA with a switching frequency of 200MHz and a 2x2mm on-chip LC output filter in 0.35mum CMOS. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3%, and the power efficiency dependence on the filter inductor are also discussed.
Keywords :
CMOS integrated circuits; DC-DC power convertors; power supply circuits; system-in-package; 3D chip stacking; 3D-structured onchip buck converter; current 70 mA; distributed power supply system; filter inductor; glass epoxy interposer; size 0.35 micron; switching frequency; Buck converters; Filters; Glass; Inductors; Manufacturing; Power supplies; Stacking; Switching converters; Switching frequency; System-on-a-chip;
Conference_Titel :
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-1810-7
Electronic_ISBN :
978-1-4244-1811-4
DOI :
10.1109/ICICDT.2008.4567240
