Title :
Practical considerations for WSI based systems
Author_Institution :
Westinghouse Electric Corp., Baltimore, MD, USA
Abstract :
The author examines some aspects of the Westinghouse WSI (wafer scale integration) development effort. The status of device production efforts is summarized, important packaging-oriented practical issues are discussed, and a particular approach to WSI packaging is presented. Some critical issues associated with overall circuit density, power distribution, signal connections, and heat removal are identified
Keywords :
VLSI; cooling; packaging; WSI based systems; WSI packaging; Westinghouse; critical issues; heat removal; overall circuit density; packaging-oriented practical issues; power distribution; signal connections; CMOS process; Integrated circuit yield; Laser beam cutting; Optical device fabrication; Packaging; Power distribution; Power generation economics; Production; Random access memory; Research and development;
Conference_Titel :
Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9126-3
DOI :
10.1109/ICWSI.1991.151734
