• DocumentCode
    2170199
  • Title

    Improving the performance of dispatching rules in semiconductor manufacturing by iterative simulation

  • Author

    Mönch, Lars ; Zimmermann, Jens

  • Author_Institution
    Inst. of Inf. Syst., Ilmenau Tech. Univ., Germany
  • Volume
    2
  • fYear
    2004
  • fDate
    5-8 Dec. 2004
  • Firstpage
    1881
  • Abstract
    In this paper, we consider semiconductor manufacturing processes that can be characterized by a diverse product mix, heterogeneous parallel machines, sequence-dependent setup times, a mix of different process types, i.e. single-wafer vs. batch processes, and reentrant process flows. We use dispatching rules that require the estimation of waiting times of the jobs. Based on the lead time iteration concept of Vepsalainen and Morton (1988), we obtain good waiting time estimates by using exponential smoothing techniques. We describe a database-driven architecture that allows for an efficient implementation of the suggested approach. We present results of computational experiments for reference models of semiconductor wafer fabrication facilities. The results demonstrate that the suggested approach leads to high quality solutions.
  • Keywords
    dispatching; manufacturing processes; parallel machines; scheduling; semiconductor device manufacture; software architecture; batch processes; database-driven architecture; dispatching rules; diverse product mix; exponential smoothing; heterogeneous parallel machines; iterative simulation; job waiting times; lead time iteration; reentrant process flows; semiconductor manufacturing processes; semiconductor wafer fabrication facilities; sequence-dependent setup times; single-wafer; Computer architecture; Databases; Dispatching; Fabrication; Manufacturing processes; Parallel machines; Semiconductor device manufacture; Semiconductor device modeling; Smoothing methods; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2004. Proceedings of the 2004 Winter
  • Print_ISBN
    0-7803-8786-4
  • Type

    conf

  • DOI
    10.1109/WSC.2004.1371544
  • Filename
    1371544