Co-simulation of ANSYS and Pro/E in thermal analysis of HB-LED lamp

Author

Ju-hua, Li ; Jun-ming, Xu

Author_Institution

Coll. of Electron. Inf., Hangzhou Dianzi Univ., Hangzhou, China

fYear

2011

fDate

9-11 Sept. 2011

Firstpage

2608

Lastpage

2610

Abstract

HB-LEDs (High brightness light emitting diodes) will bring great thermal problem, so thermal analysis and design are greatly needed for HB-LED lamp, or the luminous efficiency and LED working life will become lower. In this paper, finite element analysis software ANSYS and three-dimensional software Pro/E are used together for complicated lamp thermal analysis and design. 7W LED lamp is used as an example, the modeling of LED lamp is realized with Pro/E software, and then the model is imported into ANSYS for thermal simulation, to get the temperature distribution of LED lamp. The Pro/E is used because it has greater modeling ability than ANSYS for complicated LED lamp structures. The simulated results are compared with the measured temperature, and find the two results are similar. This process also can help to design new kinds of LED lamp.

Keywords

LED lamps; electrical engineering computing; finite element analysis; thermal analysis; ANSYS-Pro/E cosimulation; finite element analysis; high brightness LED lamp; high brightness light emitting diode; thermal analysis; three dimensional software; Finite element methods; Heating; LED lamps; Solid modeling; Temperature distribution; Thermal analysis; ANSYS; HB-LED; Pro/E; junction temperature; thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Communications and Control (ICECC), 2011 International Conference on

Conference_Location

Ningbo

Print_ISBN

978-1-4577-0320-1

Type

conf

DOI

10.1109/ICECC.2011.6066392

Filename

6066392