DocumentCode
2171908
Title
Simulation of signal propagation with prospective air gap architectures as potential solutions to achieve Moore´s law for the 32 nm node and below Cu Introduction of ULK
Author
Blampey, B. ; Gallitre, M. ; Farcy, A. ; Gosset, L.G. ; Bermond, C. ; Fléchet, B. ; Torres, J.
Author_Institution
LAHC, Univ. de Savoie, Le Bourget du Lac
fYear
2006
fDate
5-7 June 2006
Firstpage
131
Lastpage
133
Abstract
The development of 32 nm node ICs face several integration and performance issues. Air gap architecture constitutes a potential alternative to porous materials. The most promising stacks are compared in terms of signal propagation thanks to electromagnetic simulations, showing that air gaps address the challenges for considered node
Keywords
air gaps; integrated circuit interconnections; Moore law; air gap architectures; electromagnetic simulations; porous materials; signal propagation; Air gaps; Crosstalk; Delay; Dielectric materials; Dielectrics and electrical insulation; Electromagnetic propagation; Moore´s Law; Polymers; Research and development; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2006 International
Conference_Location
Burlingame, CA
Print_ISBN
1-4244-0104-6
Type
conf
DOI
10.1109/IITC.2006.1648667
Filename
1648667
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