DocumentCode
2171992
Title
Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas
Author
Brown, W. ; Elshabini, A. ; Ang, S. ; Balda, J. ; Barlow, F. ; Coubillion, R. ; Malshe, A. ; Malstrom, R. ; Mantooth, A. ; Martin, T. ; Naseem, H. ; Jones, R. ; Waite, W. ; Brown, R. ; Schmitt, N. ; Nutter, D. ; Salamo, G. ; Schaper, L. ; Schmidt, W. ; Se
Author_Institution
Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA
fYear
2000
fDate
2000
Firstpage
1278
Lastpage
1284
Abstract
The Electrical Engineering Department at University of Arkansas has been building considerable strength in Energy Efficiency/Renewable Energy Systems, Mixed-Signal, and Wireless Packaging areas. This effort is in coordination with critical other Departments within the College of Engineering; specifically Industrial Engineering and Mechanical Engineering Departments, in addition to the Physics Department within the College of Arts and Science. The High Density Electronics Center (HiDEC), established in 1992 with DARPA funds to conduct research on advanced electronic packaging technologies, enables the educators to interact within the various disciplines to achieve the set objectives of packaging in these areas. The paper will outline the mission of each area, the vision and objectives of the administration, the technical issues to be addressed, the technological challenges and barriers for the Department to face and overcome to make this vision a true reality, and the curriculum restructure. The paper will also outline how critical these strategic areas are for a national academic institution recognition and fulfillment of critical needs for our nation´s global competitiveness
Keywords
electronic engineering education; mixed analogue-digital integrated circuits; packaging; radio equipment; renewable energy sources; educational curriculum; electronic packaging; energy efficiency; mixed-signal system; renewable energy system; wireless system; Art; Educational institutions; Electronics packaging; Energy efficiency; Industrial engineering; Mechanical engineering; Paper technology; Physics; Power engineering and energy; Renewable energy resources;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853338
Filename
853338
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