• DocumentCode
    2173908
  • Title

    The influence of process parameters on the carrier generation during the hot pressing of Bi2Te3-Bi2Se 3 solid solutions

  • Author

    Ha, Heon Phil ; Kim, Tae Hoon ; Bin Hyun, Dow

  • Author_Institution
    Metals Process. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    117
  • Lastpage
    120
  • Abstract
    Hot pressed Bi2Te3-Bi2Se3 alloys show different thermoelectric properties compared to alloys grown by the ordinary zone melting growth method. When specimens were hot pressed, thermoelectric properties changed according to different particle size, pressing time and hot pressing temperature. The effects of these individual parameters on the thermoelectric properties of hot pressed materials were examined. Special emphasis was put on carrier generation mechanisms related to the following parameters; oxidation, mechanical deformation during pulverization and the hot pressing temperature. It was found that all processing parameters influence the generation of electrically active defects. Defects induced by the mechanical deformation and oxygen cause generation of donors. Defect concentration is also altered with different hot pressing temperatures depending on the amount of previously received mechanical deformation. A figure of merit of 2.4×10-3 K-1 could be obtained at an optimal process condition
  • Keywords
    bismuth compounds; carrier density; crystal defects; defect states; deformation; hot pressing; oxidation; particle size; semiconductor growth; semiconductor materials; solid solutions; thermoelectricity; zone melting; Bi2Te3-Bi2Se3; carrier generation; defect concentration; donors; electrically active defects; figure of merit; hot pressing; mechanical deformation; oxidation; particle size; pressing temperature; pressing time; process parameters; pulverization; solid solutions; thermoelectric properties; zone melting growth; Bismuth; Mechanical factors; Oxidation; Powders; Pressing; Solids; Tellurium; Temperature; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979836
  • Filename
    979836