DocumentCode
2174158
Title
Characterization of low alpha emissivity system on electroplated solder bumps
Author
Mistry, Addi ; Lee, Sung ; Enman, Cynthia ; Carroll, Barry ; Mitchell, Douglas ; Mathew, Varughese ; Weeks, Don ; Tucker, Michael
Author_Institution
Semicond. Products Sector, Motorola Inc., Austin, TX, USA
fYear
2000
fDate
2000
Firstpage
1587
Lastpage
1593
Abstract
As attention to System Soft Error Rate (SSER) grows, better semiconductor design guidelines are being created. To protect sensitive transistor nodes from alpha particles emanating from trace amounts of natural occurring radioisotopes, improved shielding materials such as die coat barrier films are being used. In parallel, the demand for lower alpha emissivity materials is growing, such that semiconductor materials suppliers and packaging groups must certify their materials as being of a certain alpha emissive content. To this end, this alpha detection system continues to gain prominence, with detection capabilities down to 0.001 alpha count/cm2/hour and sample measurement sizes to 1000 square centimeters. This study outlines a method of characterization and determines capability of the continuous gas flow proportional counter
Keywords
alpha-particle detection; alpha-particle effects; electroplated coatings; proportional counters; semiconductor device packaging; soldering; alpha detection system; alpha emissivity; continuous gas flow proportional counter; die coat barrier film; electroplated solder bump; packaging; semiconductor material; shielding material; system soft error rate; transistor node protection; Alpha particles; Error analysis; Gain measurement; Guidelines; Protection; Radioactive materials; Semiconductor device packaging; Semiconductor films; Semiconductor materials; Size measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853427
Filename
853427
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