• DocumentCode
    2174158
  • Title

    Characterization of low alpha emissivity system on electroplated solder bumps

  • Author

    Mistry, Addi ; Lee, Sung ; Enman, Cynthia ; Carroll, Barry ; Mitchell, Douglas ; Mathew, Varughese ; Weeks, Don ; Tucker, Michael

  • Author_Institution
    Semicond. Products Sector, Motorola Inc., Austin, TX, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1587
  • Lastpage
    1593
  • Abstract
    As attention to System Soft Error Rate (SSER) grows, better semiconductor design guidelines are being created. To protect sensitive transistor nodes from alpha particles emanating from trace amounts of natural occurring radioisotopes, improved shielding materials such as die coat barrier films are being used. In parallel, the demand for lower alpha emissivity materials is growing, such that semiconductor materials suppliers and packaging groups must certify their materials as being of a certain alpha emissive content. To this end, this alpha detection system continues to gain prominence, with detection capabilities down to 0.001 alpha count/cm2/hour and sample measurement sizes to 1000 square centimeters. This study outlines a method of characterization and determines capability of the continuous gas flow proportional counter
  • Keywords
    alpha-particle detection; alpha-particle effects; electroplated coatings; proportional counters; semiconductor device packaging; soldering; alpha detection system; alpha emissivity; continuous gas flow proportional counter; die coat barrier film; electroplated solder bump; packaging; semiconductor material; shielding material; system soft error rate; transistor node protection; Alpha particles; Error analysis; Gain measurement; Guidelines; Protection; Radioactive materials; Semiconductor device packaging; Semiconductor films; Semiconductor materials; Size measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853427
  • Filename
    853427