Aging studies of PBGA solder joints reflowed at different conveyor speeds

Author

Fan, S.H. ; Chan, Y.C. ; Tang, C.W. ; Lai, J.K.L.

Author_Institution

Dept. of Electron. Eng., Hong Kong Univ., China

fYear

2000

fDate

2000

Firstpage

1652

Lastpage

1657

Abstract

PBGA packages are more susceptible to solder joint fatigue problem due to the significant mismatches of the coefficient of thermal expansion (CTE) between bismaleimide triazine substrate (~15 ppm/°C) and silicon die (~2.5 ppm/°C). In this paper, the shear cycle fatigue properties of PBGA (Topline DC169) solder joints reflowed with different profiles, and aged at 125°C for 4, 9, 16, 25, and 36 days are studied. The profiles are devised to have the same “heating factor”, which is defined as the integral of the measured temperature above the liquidus (183°C) with respect to dwell time in the reflow profile, but to have different conveyor speeds. The effects of conveyor speed on the solder joint (non-aged and aged) fatigue lifetimes are investigated

Keywords

ageing; ball grid arrays; fatigue; plastic packaging; reflow soldering; 125 C; PBGA package; Topline DC16; aging; bismaleimide triazine substrate; conveyor speed; reflow soldering; shear cycling; silicon die; solder joint fatigue lifetime; Aging; Cooling; Copper; Electronic packaging thermal management; Electronics packaging; Fatigue; Grain boundaries; Semiconductor device packaging; Soldering; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853440

Filename

853440