DocumentCode :
2175347
Title :
Bi2-xSbxTe3 thick thermoelectric films obtained by electrodeposition from hydrochloric acid solutions
Author :
Nedelcu, M. ; Sima, M. ; Visan, T. ; Pascu, Tatiana ; Franga, Lzabela ; Craciunoiu, F.
Author_Institution :
Nat. Inst. for Mater. Phys., Bucharest, Romania
fYear :
2001
fDate :
2001
Firstpage :
322
Lastpage :
326
Abstract :
A method to produce composition modulated Bi2-xSbx Te3 alloys by electrodeposition has been developed. The electrolyte, which consists in a HCl 6M (pH = 0) aqueous solution, allows the codeposition of bismuth, antimony and tellurium to be accomplished at room temperature on glassy carbon, platinum or nickel electrode. The composition of the films, their crystal structures and morphology were studied as function of electrochemical parameters and bath composition. It is shown that the electrodeposits are monophasic and exhibit a polycrystalline state. The electrical resistivity was of the order of 7-10 mΩcm, whereas the electrodeposition rate value was 30-50 μm/h for the films with good thermoelectric properties
Keywords :
antimony compounds; bismuth compounds; electrical resistivity; electrodeposition; electrodeposits; semiconductor growth; semiconductor materials; semiconductor thin films; surface structure; thermoelectricity; 7 to 10 mohmcm; Bi2-xSbxTe3 thick thermoelectric films; Bi2SbTe3; C; HCl; Ni; Pt; bath composition; codeposition; composition modulated Bi2-xSbxTe3 alloys; crystal structure; electrical resistivity; electrochemical parameters; electrodeposition; electrodeposition rate; electrodeposits; film composition; film morphology; glassy carbon electrode; hydrochloric acid solution; nickel electrode; platinum electrode; thermoelectric properties; Bismuth; Electric resistance; Electrodes; Morphology; Nickel; Platinum; Tellurium; Temperature; Thermoelectricity; Tin alloys;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location :
Beijing
ISSN :
1094-2734
Print_ISBN :
0-7803-7205-0
Type :
conf
DOI :
10.1109/ICT.2001.979897
Filename :
979897
Link To Document :
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