DocumentCode
2176379
Title
Quasi-static lumped element stand-alone package model for quad flat package
Author
Paoletti, Umberto ; Hisakado, Takashi ; Wada, Osami
Author_Institution
Dept. of Electr. Eng., Kyoto Univ., Kyoto, Japan
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
57
Lastpage
60
Abstract
A new type of package model is introduced, which allows to take into account the effect of external structures, such as PCB traces and ground plane, by limiting at the same time the disclosure of internal details of the package. The model is verified with a scaled quad flat package (QFP) and two different printed circuit board (PCB) patterns, but the general procedure should be applicable to other types of package.
Keywords
electronics packaging; printed circuits; external structures; printed circuit board patterns; quasistatic lumped element stand-alone package model; scaled quad flat package; Conductors; Current distribution; Electromagnetic fields; Electromagnetic modeling; Electronics packaging; Frequency; Integrated circuit modeling; Integrated circuit packaging; Magnetic fields; Printed circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4735998
Filename
4735998
Link To Document