Title :
A circuit model for ESD performance analysis of printed circuit boards
Author :
Seol, Byong-Su ; Lee, Jong-Sung ; Lim, Jae-Deok ; Lee, Hyungseok ; Park, HarkByeong ; Nandy, Argha ; Pommerenke, David
Author_Institution :
Corp. Technol. Oper., Samsung Electron. Co. Ltd., Suwon, South Korea
Abstract :
This paper provides a SPICE-compatible circuit model for characterizing electrostatic discharge (ESD) clamping performance of protection devices mounted on printed circuit boards (PCBs). An equivalent circuit model for a commercial ESD generator is introduced and a simulation methodology of an ESD protection device with non-linear resistance characteristic using voltage controlled current source is described. These models combined to create a full circuit model with a PCB model in a SPICE-like circuit simulator. Comparison results between the simulated and measured are presented to verify the accuracy of the proposed circuit model. A trade-off analysis between the ESD clamping performance and signal integrity with the ESD protection device in high-speed applications is also presented as a case study.
Keywords :
SPICE; electrostatic discharge; equivalent circuits; printed circuits; ESD protection device; SPICE-compatible circuit model; electrostatic discharge clamping; equivalent circuit model; nonlinear resistance characteristic; performance analysis; printed circuit boards; voltage controlled current source; Character generation; Circuit simulation; Clamps; Electrical resistance measurement; Electrostatic discharge; Equivalent circuits; Performance analysis; Printed circuits; Protection; Voltage control;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736014