DocumentCode :
2177177
Title :
Thermal-aware memory mapping in 3D designs
Author :
Hsieh, Ang-Chih ; Hwang, TingTing
Author_Institution :
Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu
fYear :
2009
fDate :
20-24 April 2009
Firstpage :
1361
Lastpage :
1366
Abstract :
DRAM is usually used as main memory for program execution. The thermal behavior of a memory block in a 3D SIP is affected not only by the power behavior but also the heat dissipating ability of that block. The power behavior of a block is related to the applications run on the system while the heat dissipating ability is determined by the number of tier and the position the block locates. Therefore, a thermal-aware memory allocator should consider the following two points. First, allocator should consider not only the power behavior of a memory block but also the physical location during memory mapping, second, the changing temperature of a physical block during execution of programs. In this paper, we will propose a memory mapping algorithm taking into consideration the above-mentioned two points. Our technique can be classified as static thermal management to be applied to embedded software designs. Experiments show that our method can reduce temperature of memory system by 17.2degC as compared to a straightforward mapping in the best case, and 13.4degC in average.
Keywords :
DRAM chips; system-in-package; thermal management (packaging); 3D designs; 3D system in package; DRAM; heat dissipating ability; memory allocator; static thermal management; thermal-aware memory mapping; Computer science; Embedded software; Large scale integration; Packaging; Random access memory; Software design; Space technology; Temperature distribution; Thermal management; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
Conference_Location :
Nice
ISSN :
1530-1591
Print_ISBN :
978-1-4244-3781-8
Type :
conf
DOI :
10.1109/DATE.2009.5090876
Filename :
5090876
Link To Document :
بازگشت