Title :
Solder paste in SMT: a training perspective
Author :
Peck, Douglas J.
Author_Institution :
Adv. Electron. Interconnect Inc., USA
Abstract :
An effective stencil printing operation is essential for quality SMT assembly. This can be achieved only by thorough operator training in all aspects of the printing process. The operator must have a working knowledge of solder paste, paste quality testing, and handling. He/she must understand all aspects of printer setup, and the effects of setup deficiencies. Postprint inspection by the operator is critical in verifying print quality, as is maintenance of effective SPC monitoring
Keywords :
assembling; inspection; printed circuit manufacture; printing; quality control; soldering; statistical process control; surface mount technology; training; SMT; SPC monitoring; operator training; paste handling; paste quality testing; postprint inspection; print quality; printer setup; printing process; setup deficiencies; solder paste; stencil printing operation; training perspective; Assembly systems; Cleaning; Fabrication; Inspection; Ovens; Powders; Printers; Printing; Surface-mount technology; Testing;
Conference_Titel :
Electro 98. Professional Program Proceedings
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-4940-7
DOI :
10.1109/ELECTR.1998.682101
