Preparation and deposition process of Cu/Al powder in conductive polymer for EMI shielding

Author

Zhang, Xing ; Xia, Zhidong ; Gao, Yong ; Zhao, Shaofan

Author_Institution

Beijing Univ. of Technol., Beijing, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

Copper-aluminum powders were prepared by displacement method in aqueous system at 40°C. Composite powder´s surface topography was investigated by varying the addition of sodium fluoride (NaF). It was noted that dense and uniform copper coating was obtained when the mass ratio of NaF and aluminum powder was approximate 0.1. The mechanism of copper coating formation was discussed in detail. The deposition process was summarized to four stages, including initial reaction stage, grid formation stage, two-dimensional coating spread stage and final epitaxial growth stage.

Keywords

aluminium; coatings; composite materials; conducting polymers; copper; electromagnetic interference; electromagnetic shielding; epitaxial growth; powders; surface topography; Cu-Al; EMI shielding; aqueous system; composite powder surface topography; conductive polymer; deposition process; displacement method; final epitaxial growth stage; grid formation stage; initial reaction stage; mass ratio; preparation process; temperature 40 degC; two-dimensional coating spread stage; Aluminum; Copper; Powders; Surface morphology; Surface topography; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066828

Filename

6066828