Title :
Research on SiCp/Cu composites preparation and thixo-forming process simulation
Author :
Kaikun, Wang ; Puguang, Song
Author_Institution :
Sch. of Mater. Sci. & Eng., Univ. of Sci. & Technol. Beijing, Beijing, China
Abstract :
In this paper, SiCp/Cu composite billet was prepared by powder metallurgy and thixoforming process of electronic packaging shell with SiCp/Cu composite was simulated by the finite element software DEFORM-3D. Microstructure of SiCp/Cu composite billet was studied and the results showed that composite billet prepared by powder metallurgy was dense and the combination between SiC particles and Cu matrix was good, which was suitable for electronic packaging shell thixo-forming. The flow velocity field and the effective stress field in the thixo-forming process were simulated and analyzed. The simulation results showed that, SiCp/Cu composite electronic packaging shell with compact structure could be thixo-formed, which could meet electronic packaging shell requirements.
Keywords :
composite materials; electronics packaging; powder metallurgy; thixoforming; SiC-Cu; composite billet; composites preparation; effective stress field; electronics packaging shell; finite element software DEFORM-3D; flow velocity field; powder metallurgy; thixo-forming process simulation; thixoforming process; Billets; Copper; Electronics packaging; Microstructure; Packaging; Powders; Silicon carbide; Electronic packaging shell; Numerical simulation; Powder metallurgy; SiCp/Cu composite; Thixo-forming;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066858
