DocumentCode
2184583
Title
A novel wirebond-BGA CPU package
Author
Qidong, Wang ; Liqiang, Cao ; Jun, Li ; Jin, Zhang ; Daniel, Guidotti ; Lixi, Wan
Author_Institution
Inst. of Microelectron., Beijing, China
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
5
Abstract
The evolution of microprocessor packaging continues to be driven by ever increasing performance, economics and different market segment requirements. CPU evolution in performance/cost is driving the packaging technology continuously. Institute of Microelectronics, Chinese Academy of Sciences has implemented the CPU packaging in 2010. The fabricated package meets all the requirements by Loongson Company, and becomes the first fully domestically packaged CPU in China.
Keywords
ball grid arrays; lead bonding; CPU evolution; ball grid arrays; market segment requirements; microprocessor packaging; wirebond-BGA CPU package; Assembly; Bonding; Fingers; Packaging; Routing; Substrates; Wires; CPU package; Cavity-down; Heat dissipation; Wirebond BGA;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6066875
Filename
6066875
Link To Document