Title :
Integrated free-space optical interconnects for chip-to-chip communications
Author_Institution :
Opt. Nachrichtentech., Fern Univ., Hagen, Germany
Abstract :
Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects
Keywords :
integrated circuit interconnections; multiprocessing systems; optical information processing; optical interconnections; parallel architectures; chip-to-chip communications; compact packaging; electronic computers; optical interconnects; planar optical interconnects; planar-integrated free-space optics; Bandwidth; Integrated optics; Optical arrays; Optical device fabrication; Optical interconnections; Optical waveguides; Packaging; Semiconductor laser arrays; Sensor arrays; Wafer bonding;
Conference_Titel :
Massively Parallel Processing, 1998. Proceedings. Fifth International Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-8186-8572-7
DOI :
10.1109/MPPOI.1998.682122
