DocumentCode :
2187994
Title :
3.2 W/mm, 71% PAE AlGaN/GaN HEMT operation at 20 GHz
Author :
Sandhu, R. ; Wojtowicz, M. ; Smorchkova, I. ; Barsky, M. ; Tsai, R. ; Yang, J.W. ; Wang, H. ; Khan, M.A.
Author_Institution :
Electron. & Technol. Div., TRW Inc., Redondo Beach, CA, USA
fYear :
2002
fDate :
24-26 June 2002
Firstpage :
27
Lastpage :
28
Abstract :
In this paper we report record AlGaN/GaN HEMT operation at 20 GHz. The 500 μm total gate periphery devices exhibited a continuous wave output power of 3.2 W/mm with a gain of 5.2 dB and an associated power aided efficiency of 71%. To the best of our knowledge, these are the highest reported output power and PAE results for AlGaN/GaN HEMT devices operating at 20 GHz. AlGaN/GaN HEMTs offer increased breakdown, thermal conductivity, electron sheet carrier densities, and saturated electron velocities in comparison to existing group III-V technologies making them well suited for robust operation at frequencies through Ka-band. In order for this material system to meet the requirements for satellite communications and high performance radar, K-band operation is required. The results in this paper show promise for AlGaN/GaN HEMT operation at 20 GHz. The device layers for this study were grown by MOCVD on SiC. 0.15 μm Pt/Au T-gates in a 2 μm source-drain channel were fabricated with electron beam lithography. The devices were passivated with silicon nitride and two levels of interconnect metal including airbridges for external connection.
Keywords :
III-V semiconductors; MOCVD; aluminium compounds; electron beam lithography; electron density; gallium compounds; high electron mobility transistors; microwave field effect transistors; passivation; semiconductor device breakdown; semiconductor device metallisation; semiconductor growth; thermal conductivity; wide band gap semiconductors; 0.15 micron; 2 micron; 20 GHz; 5.2 dB; 500 micron; 71 percent; AlGaN-GaN; AlGaN/GaN HEMT operation; HEMT breakdown; K-band operation; Ka-band operation; MOCVD; PAE; Pt-Au; Pt/Au T-gates; Si/sub 3/N/sub 4/; SiC; SiC substrate; continuous wave output power; device gain; device gate periphery; electron beam lithography; electron sheet carrier density; external connection airbridges; group III-V technologies; interconnect metal; operating frequencies; power aided efficiency; radar; satellite communications; saturated electron velocity; silicon nitride passivation; source-drain channel; thermal conductivity; Aluminum gallium nitride; Charge carrier density; Electric breakdown; Electrons; Gain; Gallium nitride; HEMTs; III-V semiconductor materials; Power generation; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2002. 60th DRC. Conference Digest
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-7317-0
Type :
conf
DOI :
10.1109/DRC.2002.1029490
Filename :
1029490
Link To Document :
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