DocumentCode
2188490
Title
Efficient heterogeneous three-dimensional packaging at a system level
Author
Lyke, Jim
Author_Institution
Philips Lab., Briarcliff Manor, NY, USA
Volume
1
fYear
1997
fDate
26-30 Oct 1997
Firstpage
2.3
Abstract
While a proliferation of approaches have been proposed for three-dimensional packaging, a basic dichotimization between short stacks of regular (low-complexity) iterated assemblies and heterogeneous approaches exist. For the latter, no clear order exists, which has stifled the true acceptance of three-dimensional packaging. Barriers to advancement of heterogeneous are discussed. Two basic approaches are examined
Keywords
integrated circuit packaging; multichip modules; 3D MCM; dichotimization; digital avionics; heterogeneous approaches; heterogeneous three-dimensional packaging; iterated assemblies; memory stacks; multiple MCM; three-dimensional packaging; Assembly systems; Electronic packaging thermal management; Electronics packaging; Energy management; Laboratories; Missiles; Space technology; Space vehicles; Thermal management; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location
Irvine, CA
Print_ISBN
0-7803-4150-3
Type
conf
DOI
10.1109/DASC.1997.635038
Filename
635038
Link To Document