• DocumentCode
    2188490
  • Title

    Efficient heterogeneous three-dimensional packaging at a system level

  • Author

    Lyke, Jim

  • Author_Institution
    Philips Lab., Briarcliff Manor, NY, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    26-30 Oct 1997
  • Firstpage
    2.3
  • Abstract
    While a proliferation of approaches have been proposed for three-dimensional packaging, a basic dichotimization between short stacks of regular (low-complexity) iterated assemblies and heterogeneous approaches exist. For the latter, no clear order exists, which has stifled the true acceptance of three-dimensional packaging. Barriers to advancement of heterogeneous are discussed. Two basic approaches are examined
  • Keywords
    integrated circuit packaging; multichip modules; 3D MCM; dichotimization; digital avionics; heterogeneous approaches; heterogeneous three-dimensional packaging; iterated assemblies; memory stacks; multiple MCM; three-dimensional packaging; Assembly systems; Electronic packaging thermal management; Electronics packaging; Energy management; Laboratories; Missiles; Space technology; Space vehicles; Thermal management; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
  • Conference_Location
    Irvine, CA
  • Print_ISBN
    0-7803-4150-3
  • Type

    conf

  • DOI
    10.1109/DASC.1997.635038
  • Filename
    635038