• DocumentCode
    2188540
  • Title

    Simulation analysis of one electronic equipment

  • Author

    Xie, P.H. ; Tan, Z.L. ; Bi, J.J. ; Liu, W.L.

  • Author_Institution
    Inst. of Electrostatic&Electromagn. Protection, Mech. Eng. Coll., Shijiazhuang, China
  • fYear
    2009
  • fDate
    16-20 Sept. 2009
  • Firstpage
    212
  • Lastpage
    215
  • Abstract
    Electromagnetic simulation software FEKO was used to set up the equipment model and plane wave environment. Data showed: when frequency was lower than 50 MHz, the corresponding electromagnetic coupling field of the window appeared round distribution (x=13.4), but when frequency was higher than 250 MHz, the regional border of the window coupling field became more and more fuzzy; When frequency was 50 MHz, the back-door seam region appeared strong reaction electric current; when frequency was 650 MHz, the body surface of shell around the back door presented strong reaction electric current, and the surface reaction electric current of back door was relatively weak, which reflected the separating effect of the back-door seam; when frequency was 900 MHz, strong electromagnetic coupling area appeared outside the back door, the initial analysis was the transmission function of the equivalent aerial for the window; when frequency was from 250 MHz to 900 MHz, the reflection strengthen function to the coupling field around of the package within the equipment got obvious; very obvious resonance phenomenon appeared when frequency was 900 MHz.
  • Keywords
    computational electromagnetics; electromagnetic fields; electronic equipment testing; FEKO electromagnetic simulation software; body surface; electromagnetic coupling field; frequency 650 MHz; surface reaction electric current; window coupling field; Analytical models; Current; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic modeling; Electromagnetic reflection; Electromagnetic scattering; Electronic equipment; Frequency; Packaging machines; FEKO; aperture; electromagnetic coupling; electronic equipment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmental Electromagnetics, 2009. CEEM 2009. 5th Asia-Pacific Conference on
  • Conference_Location
    Xian
  • Print_ISBN
    978-1-4244-4344-4
  • Type

    conf

  • DOI
    10.1109/CEEM.2009.5305305
  • Filename
    5305305