• DocumentCode
    2188684
  • Title

    Effects of grooves substrate on thermal interface for the LED module

  • Author

    Peng, Tao ; Chen, Mingxiang ; Liu, Xiaogang ; Xiaobing Luo ; Liu, Sheng

  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In a typical LED package module, a grease layer forms the interface between the substrate and copper heat spreader. We propose to carve grooves on the aluminum substrate to form an array of protruding posts. Three types of grooves are designed to measure interface thermal resistance. A preliminary feasibility study shows obvious improvement in the thermal resistance of the interfaces for the formation of thinner bond line thickness. Accelerating testing results in HS020 chamber also demonstrate improved reliability against grease pump-out with protruding posts surfaces.
  • Keywords
    electronics packaging; light emitting diodes; LED package module; carve grooves; grooves substrate; thermal interface; Aluminum; Electronic packaging thermal management; Light emitting diodes; Substrates; Temperature measurement; Thermal resistance; Thermal grease; groove substrate; pump out; reliability; thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6067019
  • Filename
    6067019