DocumentCode
2188684
Title
Effects of grooves substrate on thermal interface for the LED module
Author
Peng, Tao ; Chen, Mingxiang ; Liu, Xiaogang ; Xiaobing Luo ; Liu, Sheng
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
3
Abstract
In a typical LED package module, a grease layer forms the interface between the substrate and copper heat spreader. We propose to carve grooves on the aluminum substrate to form an array of protruding posts. Three types of grooves are designed to measure interface thermal resistance. A preliminary feasibility study shows obvious improvement in the thermal resistance of the interfaces for the formation of thinner bond line thickness. Accelerating testing results in HS020 chamber also demonstrate improved reliability against grease pump-out with protruding posts surfaces.
Keywords
electronics packaging; light emitting diodes; LED package module; carve grooves; grooves substrate; thermal interface; Aluminum; Electronic packaging thermal management; Light emitting diodes; Substrates; Temperature measurement; Thermal resistance; Thermal grease; groove substrate; pump out; reliability; thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6067019
Filename
6067019
Link To Document