• DocumentCode
    2190168
  • Title

    Suppression of drain conductance frequency dispersion in InP-based HEMTs by eliminating hole accumulation

  • Author

    Arai, T. ; Sawada, K. ; Okamoto, N. ; Makiyama, K. ; Takahashi, T. ; Hara, N.

  • Author_Institution
    Fujitsu Labs. Ltd., Kanagawa, Japan
  • fYear
    2002
  • fDate
    24-26 June 2002
  • Firstpage
    167
  • Lastpage
    168
  • Abstract
    InP-based HEMTs are promising devices for large-capacity optical fiber communication systems. To enable higher bit rate systems, though, drain conductance (g/sub d/) frequency dispersion must be suppressed as it causes jitter, which reduces the size of eye pattern openings in integrated circuits. We propose a planar structure device to remarkably suppress g/sub d/ frequency dispersion by eliminating hole accumulation at the extrinsic source. The band-discontinuity between the source contact and the channel was eliminated by direct ohmic contact, which increased the flow of holes to the source contact.
  • Keywords
    III-V semiconductors; electric admittance; high electron mobility transistors; indium compounds; ohmic contacts; semiconductor device models; InGaAs-InAlAs-InP; InP; InP-based HEMTs; Ni-AuGe-Au; RF characteristics; band-discontinuity elimination; direct ohmic contact; drain conductance frequency dispersion suppression; high bit rate systems; hole accumulation elimination; jitter; optical fiber communication systems; planar structure device; Bit rate; Capacitance; HEMTs; Impact ionization; Laboratories; MODFETs; Ohmic contacts; Optical fiber communication; Optical fiber dispersion; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2002. 60th DRC. Conference Digest
  • Conference_Location
    Santa Barbara, CA, USA
  • Print_ISBN
    0-7803-7317-0
  • Type

    conf

  • DOI
    10.1109/DRC.2002.1029578
  • Filename
    1029578