• DocumentCode
    2190944
  • Title

    Low-Power and High-Performance Communication Mechanism for Dependable Embedded Systems

  • Author

    Hanawa, Toshihiro ; Boku, Taisuke ; Miura, Shin Ichi ; Okamoto, Takayuki ; Sato, Mitsuhisa ; Arimoto, Kazutami

  • Author_Institution
    Center for Comput. Sci., Univ. of Tsukuba, Tsukuba, Japan
  • fYear
    2008
  • fDate
    21-23 Jan. 2008
  • Firstpage
    67
  • Lastpage
    73
  • Abstract
    Recently, a multi-core processor has been used to improve the performance and to reduce the power consumption. In order to acquire higher performance, multiprocessor connected with the network can enlarge the processing power. Dependability is also important for the embedded system to protect from a fault and failure. We develop a parallel platform for dependable embedded system, and investigate the low-power, reliable, and high-performance communication mechanism for such platform. In this study, we propose a communicator with communication links using PCI Express Gen2, and it denotes that maximum bandwidth is 2GB/s and several watts is required for power consumption. Moreover, this platform provides fault tolerance using redundancy.
  • Keywords
    embedded systems; fault tolerance; multiprocessing systems; parallel processing; peripheral interfaces; PCI Express Gen2; communication links; dependable embedded systems; fault tolerance; high-performance communication mechanism; low-power communication mechanism; multi-core processor; multiprocessor; parallel platform; power consumption; Bandwidth; Embedded computing; Embedded system; Energy consumption; Ethernet networks; Fault tolerance; Multicore processing; Peer to peer computing; Power system reliability; Systems engineering and theory; Low-power and High-performance network; PCI Express Gen2; dependable system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Innovative Architecture for Future Generation High-Performance Processors and Systems (IWIA), 2008 International Workshop on
  • Conference_Location
    Hilo, HI
  • ISSN
    1537-3223
  • Print_ISBN
    978-1-4244-6465-4
  • Electronic_ISBN
    1537-3223
  • Type

    conf

  • DOI
    10.1109/IWIA.2008.8
  • Filename
    5453553