Title :
Proceedings 1997 IEEE Multi-Chip Module Conference
Abstract :
The following topics were dealt with: flip-chip; mixed-signal MCMs; MCM design and CAD; single-chip and multi-chip integration; interconnect analysis and simulation; test, technology and infrastructure; optical MCMs
Keywords :
multichip modules; CAD; MCM design; flip-chip; infrastructure; interconnect analysis; mixed-signal MCMs; multi-chip integration; multi-chip modules; optical MCMs; simulation; single-chip integration; technology; test;
Conference_Titel :
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location :
Santa Cruz, CA, USA
Print_ISBN :
0-8186-7789-9
DOI :
10.1109/MCMC.1997.569336
