Title :
Novel post electroplating in-situ rapid annealing process for advanced copper interconnect application
Author :
Chen, Michelle ; Shin, Ho Seon ; Cheung, Robin ; Morad, Ratson ; Dordi, Yezdi ; Rengarajan, Suraj ; Tsai, Stan
Author_Institution :
Electra Copper Program, Metal Deposition Product Bus. Group, Santa Clara, CA, USA
Abstract :
The room-temperature self-annealing behavior of electroplated (ECP) copper and its impact on device manufacturing has led to the investigation of a post ECP anneal process to stabilize copper film properties before CMP. A novel in-situ anneal chamber was developed to allow for rapid thermal annealing and cooling of ECP wafers on Applied Materials´ ElectraTM Cu Integrated ECP System. This paper reports a detailed study of this process, including the impact of anneal temperature, time, and ambient on film sheet resistance, reflectivity, microstructure, hardness, as well as CMP polishing rate. Process repeatability results from an extended reliability test of the anneal chamber integrated with the ElectraTM Cu ECP System are also presented
Keywords :
copper; electroplating; integrated circuit interconnections; integrated circuit metallisation; metallic thin films; rapid thermal annealing; Cu; Cu interconnect application; device manufacturing; film sheet resistance; hardness; microstructure; post electroplating in-situ rapid annealing process; reflectivity; room-temperature self-annealing behavior; Cooling; Copper; Manufacturing processes; Microstructure; Optical films; Rapid thermal annealing; Rapid thermal processing; Reflectivity; Sheet materials; Temperature;
Conference_Titel :
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location :
Burlingame, CA
Print_ISBN :
0-7803-6327-2
DOI :
10.1109/IITC.2000.854323
