DocumentCode
2193602
Title
Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives
Author
Louis, D. ; Beverina, A. ; Arvet, C. ; Lajoinie, E. ; Peyne, C. ; Holmes, D. ; Maloney, D. ; Lee, Sang-Rim ; Lee, S.
Author_Institution
CEA-LETI, Grenoble, France
fYear
2000
fDate
2000
Firstpage
250
Lastpage
252
Abstract
This work presents an analysis of interconnect cleaning for low-k/copper integration. Analytical and electrical data are combined to understand the mechanisms and efficacy of various available cleaning chemistries in the presence of Cu and organic, Si-based, and hybrid dielectrics
Keywords
copper; dielectric thin films; integrated circuit interconnections; surface cleaning; Cu; cleaning process; copper interconnect; low-k dielectric film; Chemistry; Cleaning; Copper; Data analysis; Dielectrics; Dry etching; Microelectronics; Surface contamination; Telecommunications; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location
Burlingame, CA
Print_ISBN
0-7803-6327-2
Type
conf
DOI
10.1109/IITC.2000.854339
Filename
854339
Link To Document