DocumentCode :
2195924
Title :
60 GHz antennas and module development for WiGig applications: “Mm-wave antenna-systems” convened session
Author :
Pilard, Romain ; Gianesello, Frederic ; Gloria, Daniel
Author_Institution :
Technol. R&D/STD/TPS Lab., STMicroelectron., Crolles, France
fYear :
2012
fDate :
26-30 March 2012
Firstpage :
2595
Lastpage :
2598
Abstract :
During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. In order to address these issues, we review in this paper achievable antenna performance discussing possible integration schemes at industrial level, describing industrial substrate solutions for MMW large volume consumer applications, antenna design and 3D on wafer characterization. A focus on High Temperature Co-fired Ceramics (HTCC) substrate based antennas is described with measured maximum gain value of 7.8 dBi at 60 GHz.
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; ceramics; high-temperature effects; millimetre wave antennas; radiofrequency integrated circuits; BiCMOS technology; HTCC substrate based antennas; MMW large volume consumer applications; Mm-wave antenna-systems; WiGig applications; achievable antenna performance; advanced CMOS technology; antenna design; chipset solutions; frequency 60 GHz; high temperature co-fired ceramics substrate based antennas; industrial level; industrial substrate solutions; low cost RFIC; low cost antennas; low cost packages; module development; research teams; wafer characterization; Antenna measurements; Antenna radiation patterns; Assembly; Millimeter wave measurements; Substrates; HTCC; Integrated antennas; gain; radiation pattern;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location :
Prague
Print_ISBN :
978-1-4577-0918-0
Electronic_ISBN :
978-1-4577-0919-7
Type :
conf
DOI :
10.1109/EuCAP.2012.6206642
Filename :
6206642
Link To Document :
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