DocumentCode
2197002
Title
Technological Use Histories for Solder Metals
Author
Graedel, T.E. ; Dong, J. ; Jiansu, Mao
Author_Institution
Center for Ind. Ecology, Yale Univ., New Haven, CT
fYear
2006
fDate
8-11 May 2006
Firstpage
201
Lastpage
205
Abstract
Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion
Keywords
bismuth; copper; lead; solders; tin; Ag; Bi; Cu; Europe; Pb; Sn; bismuth; consumer pressure; copper; industry pressure; lead-free solder; legislation; silver; solder metals; tin-lead solder; Batteries; Cable shielding; Copper; Environmentally friendly manufacturing techniques; Europe; History; Lead; Production; Silver; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location
Scottsdale, AZ
ISSN
1095-2020
Print_ISBN
1-4244-0351-0
Type
conf
DOI
10.1109/ISEE.2006.1650061
Filename
1650061
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