A low cost MCM-D technology applied to microwave integrated circuits

Author

Finardi, Célio A. ; Neto, Victor Patiri ; Fischer, R.A. ; Flacker, Alexander ; Barnett, M. ; De Almeida, Antcmio M. ; GozZi, Antonio C. ; Pagotto, Ana C.

Author_Institution

Res. & Dev. Centre, Telecomunicacoes Brasileiras SA, Campinas, Brazil

Volume

1

fYear

1995

fDate

24-27 Jul 1995

Firstpage

346

Abstract

The paper presents a new technological solution for fabricating microwave integrated circuits (MICs). This innovative approach is based on a deposited-multichip modules (MCM-D) technology developed at the R&D Centre of TELEBRAS. A description of the processing is presented and some results of MICs fabricated on alumina 96% are shown. The main features of this packaging technology are its low cost (<US$1.5/in ²), process simplification, reproducibility and microwave devices assembly compatibility. The paper demonstrates an easy solution for MICs fabrication that can be implemented with low investments

Keywords

hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; microwave integrated circuits; multichip modules; Al₂O₃; MCM-D technology; MIC fabrication; TELEBRAS; alumina; deposited-multichip modules; low cost MCM-D technology; microwave devices assembly compatibility; microwave integrated circuits; packaging technology; reproducibility; Assembly; Costs; Fabrication; Integrated circuit packaging; Integrated circuit technology; Microwave devices; Microwave integrated circuits; Microwave technology; Paper technology; Reproducibility of results;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Optoelectronics Conference, 1995. Proceedings., 1995 SBMO/IEEE MTT-S International

Conference_Location

Rio de Janeiro

Print_ISBN

0-7803-2674-1

Type

conf

DOI

10.1109/SBMOMO.1995.509644

Filename

509644