DocumentCode
2197253
Title
Environmental Impact Evaluation Methodology for Emerging Silicon-Based Technologies
Author
Somani, Ajay ; Gschwend, Philip ; White, Sarah Jane ; Boning, Duane ; Reif, Rafael
Author_Institution
Massachusetts Inst. of Technol., Cambridge, MA
fYear
2006
fDate
8-11 May 2006
Firstpage
258
Lastpage
263
Abstract
Semiconductor technology evolves rapidly to enable continued improvements in performance and capability, and reductions in cost. We emphasize the need also for rapid EHS assessment of new technology alternatives. This effort provides a rapid methodology for evaluating new process options in the research phase, particularly to identify unit processes which may be of environmental concern compared to existing technologies. The use of novel materials should be estimated, in the context of both the fabrication facility and the local and global natural cycles. Unit processes of concern should be jointly optimized on the three axes of cost, performance, and environment. A case study examining 3D integration of ICs, with a focus on the handle wafer unit process steps, illustrates the proposed methodology
Keywords
environmental factors; health and safety; integrated circuit manufacture; product life cycle management; 3D integration; EHS assessment; environmental impact evaluation; fabrication facility; life cycle analysis; semiconductor technology; Conducting materials; Cost function; Decision making; Fabrication; Health and safety; Investments; Performance analysis; Research and development; Semiconductor device manufacture; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location
Scottsdale, AZ
ISSN
1095-2020
Print_ISBN
1-4244-0351-0
Type
conf
DOI
10.1109/ISEE.2006.1650072
Filename
1650072
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