• DocumentCode
    2197757
  • Title

    An Intelligent Product Disassembly Planning Method

  • Author

    Hui, Wang ; Dong, Xiang ; Guanghong, Duan

  • Author_Institution
    Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing
  • fYear
    2006
  • fDate
    8-11 May 2006
  • Firstpage
    357
  • Lastpage
    357
  • Abstract
    Disassembly sequence planning problem is a NP-hard combinatorial optimization problem. Generally, with the increasing of components number, the computational complexity of searching for good disassembly solution(s) in a large search space of disassembly solutions will be increased more. Therefore, to avoid the exploded combination, heuristic methods are often used for the goal of finding optimum solution(s) at a high efficiency. In the proposed research, we present the disassembly feasibility information graph (DFIG) to describe product´s disassembly operations (sequences) information. In fact, this graph is a model of simulated all possible disassembly operations, and meanwhile, stored relevant information of operations which includes feasibility of operations and disassembly processes if these operations are feasible. Based on this graph, product´s disassembly sequences planning problem could be transformed into this problem: On the DFIG, to find out a path with an optimized sum value, which starts from the start point, and could tour all the components of product just one time, along with the weighed, directed edges
  • Keywords
    assembly planning; computational complexity; design for disassembly; genetic algorithms; graph theory; NP-hard combinatorial optimization; computational complexity; disassembly feasibility information graph; disassembly sequence planning; genetic algorithm; Biological cells; Computational complexity; Computational intelligence; Encoding; Filling; Genetic algorithms; Instruments; Path planning; Software systems; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
  • Conference_Location
    Scottsdale, AZ
  • ISSN
    1095-2020
  • Print_ISBN
    1-4244-0351-0
  • Type

    conf

  • DOI
    10.1109/ISEE.2006.1650092
  • Filename
    1650092