DocumentCode
2200344
Title
The effects of radiation on identical devices with different types of packaging
Author
Dowling, S. ; West, R.H.
Author_Institution
R. Mil. Coll. of Sci., Cranfield Univ., Swindon, UK
fYear
1995
fDate
18-22 Sep 1995
Firstpage
244
Lastpage
248
Abstract
NPN transistor structures taken from the same wafer of silicon have been packaged in different ways. The variation of their response to total dose has been investigated for different bias conditions
Keywords
bipolar transistors; elemental semiconductors; radiation effects; semiconductor device packaging; semiconductor device testing; silicon; NPN transistor structures; Si; bias conditions; elemental semiconductors; packaging; radiation effects; total dose; Ceramics; Circuit testing; Degradation; Educational institutions; Geometry; Manufacturing; Passivation; Plastic packaging; Radiation monitoring; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Radiation and its Effects on Components and Systems, 1995. RADECS 95., Third European Conference on
Conference_Location
Arcachon
Print_ISBN
0-7803-3093-5
Type
conf
DOI
10.1109/RADECS.1995.509784
Filename
509784
Link To Document