Title :
Integrated circuit cofired laminated ceramic package antenna
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Abstract :
A novel concept to implement an antenna on an integrated circuit package is proposed for the single-chip solution of a wireless transceiver using deep submicron CMOS technology. The prototype antenna printed on a 40-pin dual-in-line cofired laminated ceramic package is experimentally studied at 3.45 GHz. The results show that the antenna has achieved a bandwidth of 25.1% and a gain of -2.0 dBi
Keywords :
CMOS integrated circuits; antenna radiation patterns; ceramic packaging; integrated circuit packaging; microstrip antennas; transceivers; 3.45 GHz; DIL cofired laminated ceramic package; IC package antenna; deep submicron CMOS technology; dual-in-line package; integrated circuit package; printed antenna; single-chip wireless transceiver; Bandwidth; CMOS technology; Ceramics; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Metallization; Prototypes; Semiconductor device packaging; Transceivers;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981432
