Title :
Automated Inspection Of IC Bonding Wires Using Hough Transforf4
Author_Institution :
University of Singapore
Keywords :
Bonding; Cameras; Equations; Humans; Image edge detection; Inspection; Machine vision; Microassembly; Packaging; Wires;
Conference_Titel :
Industrial Electronics Society, 1988. IECON '88. Proceedings., 14 Annual Conference of
Conference_Location :
Singapore
DOI :
10.1109/IECON.1988.666270
