DocumentCode :
2212033
Title :
Technological issues for high-density MRAM
Author :
Kim, Taewan ; Hwang, Injun ; Cho, Young-Jin ; Kim, Kwang-suk ; Kim, Keewon
Author_Institution :
Samsung Adv. Inst. of Technol., Suwon
Volume :
1
fYear :
2006
fDate :
22-25 Oct. 2006
Firstpage :
182
Lastpage :
182
Abstract :
Key attributes of MRAM (magnetoresistive random access memory) technology are known as non-volatility with high speed and density, radiation hardness, and unlimited endurance. A lot of results have been announced for commercial market. It is anticipated that MRAM would play an important role in future memory market through its unique, functional advantages. For high density MRAM as a standalone memory, several technological issues related with MRAM core cells should be preferentially solved, we demonstrated 1 Kbit MRAM array fabricated by combination of hybrid technology of standard deep sub-micron CMOS and MTJ process. The main issues in the array, which can be fundamental limitation of MRAM technology, are considered. The topic covers basic issues of deep sub-micron MRAM core cell and consider the work related to the MRAM issues, such as cell stability and switching process.
Keywords :
CMOS memory circuits; magnetic storage; magnetoresistive devices; random-access storage; semiconductor technology; MRAM array; MTJ process; cell stability; high-density MRAM; hybrid technology; magnetoresistive random access memory; standard deep sub-micron CMOS process; submicron MRAM core cell; switching process; technological issue; CMOS process; CMOS technology; Magnetoresistance; Random access memory; Stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location :
Gyeongju
Print_ISBN :
978-1-4244-0541-1
Electronic_ISBN :
978-1-4244-0541-1
Type :
conf
DOI :
10.1109/NMDC.2006.4388735
Filename :
4388735
Link To Document :
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