• DocumentCode
    2213402
  • Title

    Fabrication of Permittivity Graded Materials for Reducing Electric Stress on Electrode Surface

  • Author

    Kurimoto, Muneaki ; Kai, Akihiro ; Kato, Katsumi ; Okubo, Hitoshi

  • Author_Institution
    Nagoya Univ., Nagoya
  • fYear
    2008
  • fDate
    9-12 June 2008
  • Firstpage
    265
  • Lastpage
    268
  • Abstract
    For the size reduction of electric power equipment, an increase of electric field stress around solid insulators is carefully to be considered. The application of FGM (Functionally Graded Materials) with spatial distribution of dielectric permittivity (epsiv-FGM) will be an effective solution for this concern. In this paper, we investigated the fabrication techniques of epsiv-FGM for reducing the electric stress on the electrode surface with contact to the solid insulator, which was one of the factors dominating a long-term insulating property of the spacer. Firstly, we carried out numerical simulation to investigate the reduction of the electric stress by U shape permittivity distribution. Secondly, we investigated the fabrication feasibility of epsiv-FGM with the U shape distribution. Finally, we could confirm the significant effect of application to solid dielectrics in electric power equipment.
  • Keywords
    dielectric materials; electrodes; insulators; permittivity; U shape permittivity distribution; dielectric permittivity; electric field stress; electric power equipment; electrode surface; functionally graded materials; long-term insulating property; permittivity graded materials; solid dielectrics; solid insulators; Dielectric materials; Dielectrics and electrical insulation; Electrodes; Fabrication; Gas insulation; Numerical simulation; Permittivity; Shape; Solids; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
  • Conference_Location
    Vancouver, BC
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-2091-9
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2008.4570325
  • Filename
    4570325