DocumentCode :
2213735
Title :
ANSYS-based detailed thermo-mechanical modeling of complex thermoelectric power designs
Author :
Soto, Marco A. ; Venkatasubramanian, Rama
Author_Institution :
Res. Triangle Inst., Research Triangle Park, NC, USA
fYear :
2005
fDate :
19-23 June 2005
Firstpage :
219
Lastpage :
221
Abstract :
Using Finite Element Analysis (FEA) via ANSYS Workbench simulation software, complicated coupled-field analyses of thermoelectric devices can be performed. This is effective in examining the thermo-mechanical stresses introduced in these devices through their operation. Due to the large temperature gradients inherent in their operation, as well as the mismatch in coefficients of thermal expansion, large stresses can be present during power generation. This stress can lead to device failure in several ways; the device may break, bowing of the system may lead to a loss in thermal contact between layers and subsequent reduction in heat transfer. FEA simulations examined the mechanical behavior of the device at operating temperatures, including; determination of the optimum pellet length for shear stress minimization, and modeling the behavior of Niobium compliance pads in the system.
Keywords :
bending; failure (mechanical); finite element analysis; fracture; heat transfer; internal stresses; niobium; physics computing; thermal expansion; thermal stresses; thermoelectric conversion; thermoelectric devices; thermoelectric power; ANSYS Workbench simulation software; ANSYS-based detailed thermo-mechanical modeling; FEA; Finite Element Analysis; Nb; Niobium compliance pads; bowing; complex thermoelectric power designs; coupled-field analyses; device failure; heat transfer reduction; optimum pellet length; power generation; shear stress minimization; system breakage; thermal contact; thermal expansion coefficient; thermo-mechanical stress; thermoelectric devices; Analytical models; Finite element methods; Performance analysis; Software performance; Temperature; Thermal expansion; Thermal stresses; Thermoelectric devices; Thermoelectricity; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN :
1094-2734
Print_ISBN :
0-7803-9552-2
Type :
conf
DOI :
10.1109/ICT.2005.1519923
Filename :
1519923
Link To Document :
بازگشت