• DocumentCode
    2214728
  • Title

    Effect of resistance of TSV´s on performance of boost converter for low power 3D SSD with NAND flash memories

  • Author

    Yasufuku, Tadashi ; Ishida, Koichi ; Miyamoto, Shinji ; Nakai, Hiroto ; Takamiya, Makoto ; Sakurai, Takayasu ; Takeuchi, Ken

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • fYear
    2009
  • fDate
    28-30 Sept. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper investigates the effect of the TSV resistance (RTSV) on the performance of boost converters for Solid State Drive (SSD) using circuit simulation. When RTSV is 0 Omega, both the rising time (trise) from 0 V to 15 V and the energy during boosting (Eloss) of the output voltage (VOUT) are 10.6% and 6.6% of the conventional charge pump respectively. In contrast, when RTSV is 200 Omega, for example, trise is 30.1% and Eloss is 22.8% of the conventional charge pump. Besides, VOUT cannot be boosted above 20 V when RTSV is larger than 210 Omega. Therefore, in order to maintain the advantages of the boost converter over the charge pump in terms of trise and Eloss, the reduction of RTSV is very important.
  • Keywords
    circuit simulation; flash memories; low-power electronics; power convertors; NAND flash memories; TSV; boost converter; circuit simulation; low power 3D SSD; resistance 200 ohm; solid state drive; voltage 0 V to 15 V; Boosting; Charge measurement; Charge pumps; Circuits; Current measurement; Inductors; Parasitic capacitance; Random access memory; Through-silicon vias; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-4511-0
  • Electronic_ISBN
    978-1-4244-4512-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2009.5306594
  • Filename
    5306594