DocumentCode
2214728
Title
Effect of resistance of TSV´s on performance of boost converter for low power 3D SSD with NAND flash memories
Author
Yasufuku, Tadashi ; Ishida, Koichi ; Miyamoto, Shinji ; Nakai, Hiroto ; Takamiya, Makoto ; Sakurai, Takayasu ; Takeuchi, Ken
Author_Institution
Univ. of Tokyo, Tokyo, Japan
fYear
2009
fDate
28-30 Sept. 2009
Firstpage
1
Lastpage
4
Abstract
This paper investigates the effect of the TSV resistance (RTSV) on the performance of boost converters for Solid State Drive (SSD) using circuit simulation. When RTSV is 0 Omega, both the rising time (trise) from 0 V to 15 V and the energy during boosting (Eloss) of the output voltage (VOUT) are 10.6% and 6.6% of the conventional charge pump respectively. In contrast, when RTSV is 200 Omega, for example, trise is 30.1% and Eloss is 22.8% of the conventional charge pump. Besides, VOUT cannot be boosted above 20 V when RTSV is larger than 210 Omega. Therefore, in order to maintain the advantages of the boost converter over the charge pump in terms of trise and Eloss, the reduction of RTSV is very important.
Keywords
circuit simulation; flash memories; low-power electronics; power convertors; NAND flash memories; TSV; boost converter; circuit simulation; low power 3D SSD; resistance 200 ohm; solid state drive; voltage 0 V to 15 V; Boosting; Charge measurement; Charge pumps; Circuits; Current measurement; Inductors; Parasitic capacitance; Random access memory; Through-silicon vias; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
978-1-4244-4511-0
Electronic_ISBN
978-1-4244-4512-7
Type
conf
DOI
10.1109/3DIC.2009.5306594
Filename
5306594
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