DocumentCode
2214890
Title
Thermoelectric properties and microstructure of Co-doped iron-silicides mixed with Ag or Cu
Author
Hasaka, M. ; Morimura, T. ; Watanabe, T. ; Etoh, Y. ; Nakashima, H.
Author_Institution
Dept. of Mater. Sci. & Eng., Nagasaki Univ., Japan
fYear
2005
fDate
19-23 June 2005
Firstpage
419
Lastpage
422
Abstract
Spin-cast ribbons and sintered discs of the Co-doped iron disilicides mixed with Ag or Cu were prepared and investigated by measuring the Seebeck coefficient, electrical conductivity, power factor, dimensionless figure of merit, and thermal conductivity at 300 K. The microstructure was characterized by powder X-ray diffraction analysis and transmission electron microscopic analysis. The ribbons and bulks possess an n-type of polarity. The Seebeck coefficient, electrical conductivity, power factor, dimensionless figure of merit, and thermal conductivity depend on the Si, Ag, or Cu content. The thermoelectric properties differ from the ribbons to the discs. The Ag or Cu phase disperses at grain boundaries and matrix of the β phase, and contributes to form the β phase, and is effective to improve the thermoelectric properties.
Keywords
Seebeck effect; X-ray diffraction; cobalt alloys; copper alloys; electrical conductivity; grain boundaries; iron alloys; silicon alloys; silver alloys; thermal conductivity; transmission electron microscopy; (Fe0.97Co0.03Six)100-y-zAgyCuz; 300 K; Co-doped iron-silicides; Seebeck coefficient; dimensionless figure of merit; electrical conductivity; grain boundaries; microstructure; powder X-ray diffraction; power factor; sintered discs; spin-cast ribbons; thermal conductivity; thermoelectric properties; transmission electron microscopy; Conductivity measurement; Electric variables measurement; Iron; Microstructure; Powders; Power measurement; Reactive power; Thermal conductivity; Thermal factors; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN
1094-2734
Print_ISBN
0-7803-9552-2
Type
conf
DOI
10.1109/ICT.2005.1519976
Filename
1519976
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