• DocumentCode
    2214890
  • Title

    Thermoelectric properties and microstructure of Co-doped iron-silicides mixed with Ag or Cu

  • Author

    Hasaka, M. ; Morimura, T. ; Watanabe, T. ; Etoh, Y. ; Nakashima, H.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nagasaki Univ., Japan
  • fYear
    2005
  • fDate
    19-23 June 2005
  • Firstpage
    419
  • Lastpage
    422
  • Abstract
    Spin-cast ribbons and sintered discs of the Co-doped iron disilicides mixed with Ag or Cu were prepared and investigated by measuring the Seebeck coefficient, electrical conductivity, power factor, dimensionless figure of merit, and thermal conductivity at 300 K. The microstructure was characterized by powder X-ray diffraction analysis and transmission electron microscopic analysis. The ribbons and bulks possess an n-type of polarity. The Seebeck coefficient, electrical conductivity, power factor, dimensionless figure of merit, and thermal conductivity depend on the Si, Ag, or Cu content. The thermoelectric properties differ from the ribbons to the discs. The Ag or Cu phase disperses at grain boundaries and matrix of the β phase, and contributes to form the β phase, and is effective to improve the thermoelectric properties.
  • Keywords
    Seebeck effect; X-ray diffraction; cobalt alloys; copper alloys; electrical conductivity; grain boundaries; iron alloys; silicon alloys; silver alloys; thermal conductivity; transmission electron microscopy; (Fe0.97Co0.03Six)100-y-zAgyCuz; 300 K; Co-doped iron-silicides; Seebeck coefficient; dimensionless figure of merit; electrical conductivity; grain boundaries; microstructure; powder X-ray diffraction; power factor; sintered discs; spin-cast ribbons; thermal conductivity; thermoelectric properties; transmission electron microscopy; Conductivity measurement; Electric variables measurement; Iron; Microstructure; Powders; Power measurement; Reactive power; Thermal conductivity; Thermal factors; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2005. ICT 2005. 24th International Conference on
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-9552-2
  • Type

    conf

  • DOI
    10.1109/ICT.2005.1519976
  • Filename
    1519976