DocumentCode
2214903
Title
Table of contents
fYear
2009
fDate
28-30 Sept. 2009
Firstpage
1
Lastpage
15
Abstract
The following topics are dealt with: copper through silicon vias; die-to-wafer direct bonding and planarization; MEMS-LSI multi-chip module; high energy physics; 3D-integrated circuit technology; multi-processor network-on-chip; and NAND flash memories.
Keywords
copper; flash memories; large scale integration; logic design; micromechanical devices; network-on-chip; silicon; wafer-scale integration; 3D-integrated circuit technology; MEMS-LSI multichip module; NAND flash memories; copper; die-to-wafer direct bonding; die-to-wafer direct planarization; high energy physics; multiprocessor network-on-chip; through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
978-1-4244-4511-0
Type
conf
DOI
10.1109/3DIC.2009.5306601
Filename
5306601
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