DocumentCode
2216079
Title
Design of a Folded-Patch Chip-Size Antenna for Short-Range Communications
Author
Mendes, P.M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J.N. ; Correia, J.H.
Author_Institution
Dept. of Industrial Electronics, University of Minho, Portugal. Tel.: +351 253510184, Fax: +351 253510189, e-mail: paulo.mendes@dei.uminho.pt
fYear
2003
fDate
Oct. 2003
Firstpage
723
Lastpage
726
Abstract
We report on design of an integrated folded shorted-patch (FSP) chip-size antenna for operation at 5.7 GHz and use in short-range wireless communications. Application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows antenna on-chip integration. The operating characteristics of a folded S-P antenna built on two stacked glass substrates were analysed with respect to substrate thickness, middle patch length and substrate sidewall angles. Antenna size reduction down to 4x4x1 mm3, efficiency of 66 % and bandwidth of 62 MHz are predicted.
Keywords
Chip scale packaging; Fabrication; Glass; Patch antennas; Prototypes; Semiconductor device modeling; Silicon; Wafer bonding; Wafer scale integration; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2003 33rd European
Conference_Location
Munich, Germany
Print_ISBN
1-58053-834-7
Type
conf
DOI
10.1109/EUMA.2003.341055
Filename
4143119
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