Title :
Dynamic characteristics of novel single-chip fabricated corrugated diaphragms for micro-acoustic devices
Author :
Jing, Chen ; Litian, Liu ; Zhijian, Li
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
A novel single-chip fabricated corrugated diaphragm has been adopted in the design and fabrication of micro-acoustic devices for stress release. Several new kinds of corrugated diaphragms are proposed with the single-chip fabrication process described. Numerical simulation is conducted in order to evaluate the influence of residual stress and air damping on the dynamic characteristics of different kinds of corrugated diaphragms as well as corresponding flat diaphragm in audio frequency. The numerical results reveal that each kind of diaphragm is preferable for certain acoustic applications.
Keywords :
acoustic devices; diaphragms; internal stresses; micromechanical devices; air damping; microacoustic devices; numerical simulation; residual stress; single-chip fabricated corrugated diaphragm; stress release; Acoustic applications; Damping; Etching; Fabrication; Frequency; Microelectromechanical devices; Numerical simulation; Optical devices; Residual stresses; Silicon;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.982005
