• DocumentCode
    2218147
  • Title

    Device engineering for a modular 650 V transistor assortment

  • Author

    Lerner, Ralf ; Schottmann, Klaus ; Kittler, Gabriel

  • Author_Institution
    X-FAB Semicond. Foundries AG, Erfurt, Germany
  • fYear
    2011
  • fDate
    27-28 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Using a trench isolated 650 V quasi-vertical n-channel DMOS as a starting point several new 650 V transistor types have been evaluated. Mainly by design measures a 650 V depletion DMOS, a 650 V PMOS and a 650 V IGBT were created for a modular integration into the process flow. Design modifications like increased channel length, well constructions and drain modifications were used to create the new devices. Original n-channel DMOS design features like curvatures or field plate constructions have been re-used. Necessary new process steps for the depletion transistor and for the IGBT were kept to minimum additional process effort and use a flexible process approach with independent addable modules.
  • Keywords
    MOS integrated circuits; insulated gate bipolar transistors; IGBT; channel length; depletion transistor; device engineering; drain modification; field plate constructions; modular 650 V transistor assortment; modular integration; n-channel DMOS design; process flow; trench isolated 650 V quasi-vertical n-channel DMOS; voltage 650 V; Breakdown voltage; Doping; Implants; Insulated gate bipolar transistors; Layout; Logic gates; Transistors; High voltage transistor; SOI; Trench;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference Dresden (SCD), 2011
  • Conference_Location
    Dresden
  • Print_ISBN
    978-1-4577-0431-4
  • Type

    conf

  • DOI
    10.1109/SCD.2011.6068713
  • Filename
    6068713