DocumentCode
2218147
Title
Device engineering for a modular 650 V transistor assortment
Author
Lerner, Ralf ; Schottmann, Klaus ; Kittler, Gabriel
Author_Institution
X-FAB Semicond. Foundries AG, Erfurt, Germany
fYear
2011
fDate
27-28 Sept. 2011
Firstpage
1
Lastpage
4
Abstract
Using a trench isolated 650 V quasi-vertical n-channel DMOS as a starting point several new 650 V transistor types have been evaluated. Mainly by design measures a 650 V depletion DMOS, a 650 V PMOS and a 650 V IGBT were created for a modular integration into the process flow. Design modifications like increased channel length, well constructions and drain modifications were used to create the new devices. Original n-channel DMOS design features like curvatures or field plate constructions have been re-used. Necessary new process steps for the depletion transistor and for the IGBT were kept to minimum additional process effort and use a flexible process approach with independent addable modules.
Keywords
MOS integrated circuits; insulated gate bipolar transistors; IGBT; channel length; depletion transistor; device engineering; drain modification; field plate constructions; modular 650 V transistor assortment; modular integration; n-channel DMOS design; process flow; trench isolated 650 V quasi-vertical n-channel DMOS; voltage 650 V; Breakdown voltage; Doping; Implants; Insulated gate bipolar transistors; Layout; Logic gates; Transistors; High voltage transistor; SOI; Trench;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference Dresden (SCD), 2011
Conference_Location
Dresden
Print_ISBN
978-1-4577-0431-4
Type
conf
DOI
10.1109/SCD.2011.6068713
Filename
6068713
Link To Document