DocumentCode
2218243
Title
A cost analysis study of deposited-MCM active substrates for testability purposes
Author
Oliver, J. ; Kerkhoff, H.
Author_Institution
CNM Inst., Univ. Autonoma de Barcelona, Spain
fYear
1996
fDate
6-7 Feb 1996
Firstpage
80
Lastpage
85
Abstract
MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates
Keywords
boundary scan testing; flip-chip devices; integrated circuit testing; multichip modules; substrates; MCM testing; cost analysis; deposited-MCM active substrates; flip-chip connected circuits; multichip modules; test structures; testability purposes; yield calculations; Automatic testing; Capacitance; Circuit testing; Costs; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Integrated circuit testing; Manufacturing; Multichip modules;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-7286-2
Type
conf
DOI
10.1109/MCMC.1996.510773
Filename
510773
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