Study on self-heat effects in integrated circuits with hot-spot and electro-thermal coupling methods

Author

Miao, Liu ; Runde, Zhou ; Songliang, Jia ; Yuqin, Gu ; Xingang, Liang ; Ronghai, Zhang

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

fYear

2001

fDate

2001

Firstpage

880

Lastpage

883

Abstract

The self-heat effects in integrated circuits have great impact on circuit performance and power consumption. Based on HSPICE circuit simulator and improved Hot-Spot thermal analysis, this paper presents a new fast electro-thermal relaxation method to study the self-heat effects. Given the layout information and the input signal pattern, the developed method may calculate the temperature distribution of a chip, and investigate the chip performance under the distribution. With infrared thermal image system, the measured temperature distribution of the facsimile thermal printing head ASIC chip agrees very well with the simulation result

Keywords

SPICE; VLSI; application specific integrated circuits; circuit CAD; infrared imaging; integrated circuit design; low-power electronics; power consumption; relaxation; temperature distribution; thermal analysis; ASIC; HSPICE circuit simulator; IR thermal image system; electro-thermal relaxation; facsimile thermal printing head; hot-spot thermal analysis; integrated circuits; power consumption; self-heat effects; temperature distribution; Analytical models; Circuit optimization; Circuit simulation; Energy consumption; Facsimile; Infrared imaging; Relaxation methods; Semiconductor device measurement; Temperature distribution; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC, 2001. Proceedings. 4th International Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-6677-8

Type

conf

DOI

10.1109/ICASIC.2001.982705

Filename

982705