DocumentCode
2232080
Title
A Study on the Application of Six Sigma Tools to PSP/TSP for Process Improvement
Author
Park, Youngkyu ; Park, Hyuncheol ; Choi, Hojin ; Baik, Jongmoon
Author_Institution
Inf. & Commun. Univ., Deajeon
fYear
2006
fDate
10-12 July 2006
Firstpage
174
Lastpage
179
Abstract
The advent of software process models such as CMM/CMMI has helped software engineers understand principles and approaches of software process improvement. There, however, has been difficulty increasing productivity from applying these models since "how" is not within the scope of the CMM/CMMI. For this reason, SEI introduced PSP/TSP, but those still lack analysis tools and systematic process control techniques for analyzing metrics collected in PSP/TSP. Six sigma, on the other hand, provides the quantitative analysis tools necessary to control process performance. Deploying PSP/TSP in conjunction with six sigma, therefore, can enable software engineers to analyze PSP data, and to systematically improve process performance. Continuing with this rationale, we map six sigma tools to each PSP process in order to show what six sigma techniques can be applied to PSP data and suggest six sigma practical use guideline to support process improvement activity at the individual and team level
Keywords
six sigma (quality); software metrics; software process improvement; software quality; CMM; CMMI; personal software process; quantitative analysis tool; six sigma tool; software metrics; software process improvement; systematic process control technique; team software process; Application software; Control system analysis; Coordinate measuring machines; Data analysis; Data engineering; Performance analysis; Process control; Productivity; Six sigma; Software performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer and Information Science, 2006 and 2006 1st IEEE/ACIS International Workshop on Component-Based Software Engineering, Software Architecture and Reuse. ICIS-COMSAR 2006. 5th IEEE/ACIS International Conference on
Conference_Location
Honolulu, HI
Print_ISBN
0-7695-2613-6
Type
conf
DOI
10.1109/ICIS-COMSAR.2006.13
Filename
1651988
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